HIGH-FREQUENCY SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the high-frequency characteristic of a resin sealed package and reduce the cost by forming leads having step-like swollen parts at the center of a package and parts horizontally extending out from the package in parallel to its bottom face. SOLUTION: Leads 15 have parts swollen up like steps in a central area of a resin sealed package 7 and extend horizontally out from the package in parallel to its bottom face with a space of about 0.1mm or less between the package bottom face and the outside extended parts of the leads 15. A chip 1 is die-bonded to a source lead 15a in a swollen part of a lead frame by using a die bonding material 3 and the leads 15 are electrically connected to terminals of a semiconductor element 1 by the wire bonding with Au wires 2.