发明名称 HYBRID INTEGRATED CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To lower desired wiring impedance by forming grips of a conductive metal member at positions corresponding to desired electrodes and inserting and holding a circuit board by the grips to electrically connect desired electrodes to corresponding grips. SOLUTION: A circuit board 1 is held by grips 12, 13 of a conductive metal member 10 so as to electrically connect the grips 12, 13 to electrodes 6, 7 and the grips 12, 13 are soldered to the electrodes 6, 7. Lead terminals are soldered to electrodes 5, 8. The electrode 7 is electrically connected to the electrode 6 through he metal member 10. Lead terminals are connected to an external ground to lower the impedance of a ground wiring on the circuit board 1 through the metal member 10.</p>
申请公布号 JPH09307202(A) 申请公布日期 1997.11.28
申请号 JP19960124760 申请日期 1996.05.20
申请人 MITSUBISHI ELECTRIC CORP 发明人 YASUDA YUKIHISA
分类号 H05K1/02;H05K1/03;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):H05K1/02 主分类号 H05K1/02
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