Test specimen critical dimension measurement system for e.g. semiconductor manufacture

摘要

The system generates an image of the section of the specimen (5) of which the critical measurement is to be measured. In advance the system stores a measurement reference image corresponding to the measured section. This stored image is compared to the image of the section generated. From the results of the comparison the difference in form between the two images provides the basis for determining the critical dimension. Parameters relating to both the measured section and the reference image can be changed independently of one another or several images can be used for the comparison with that of the measured section.