发明名称 |
Metal sputtering target assembly |
摘要 |
Described is a method of manufacturing a sputtering target or backing plate for a sputtering target that minimizes metal waste and reduces manufacturing steps. The target or backing plate is made from a substantially circular metal blank by progressively deforming circumferential bands until the blank is in the shape of a sputtering target or backing plate. The target and backing plate so produced are also described.
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申请公布号 |
US5687600(A) |
申请公布日期 |
1997.11.18 |
申请号 |
US19960690988 |
申请日期 |
1996.08.01 |
申请人 |
JOHNSON MATTHEY ELECTRONICS, INC. |
发明人 |
EMIGH, ROGER ALAN;WILLETT, WILLIAM BRYCE |
分类号 |
C23C14/34;(IPC1-7):B21D22/16 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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