发明名称 Metal sputtering target assembly
摘要 Described is a method of manufacturing a sputtering target or backing plate for a sputtering target that minimizes metal waste and reduces manufacturing steps. The target or backing plate is made from a substantially circular metal blank by progressively deforming circumferential bands until the blank is in the shape of a sputtering target or backing plate. The target and backing plate so produced are also described.
申请公布号 US5687600(A) 申请公布日期 1997.11.18
申请号 US19960690988 申请日期 1996.08.01
申请人 JOHNSON MATTHEY ELECTRONICS, INC. 发明人 EMIGH, ROGER ALAN;WILLETT, WILLIAM BRYCE
分类号 C23C14/34;(IPC1-7):B21D22/16 主分类号 C23C14/34
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