| 摘要 |
PROBLEM TO BE SOLVED: To restrain the progress of the choking of a polish pad and stabilize the polishing speed of a wafer over a long term. SOLUTION: In this device, a polish pad stuck to a polish surface plate is pressed to a wafer held on a wafer placing part and a polish slurry is supplied between the wafer and the polish pad and the wafer is polished by rotating any one or both of the wafer placing part, a test piece stand and the polish surface plate. The groove 21 of a retainer 13 installed on the outer periphery part of the wafer placing surface of the wafer placing part is formed in such shape that the distance RV, RW, RX, RY, RZ from the center of the retainer is increased in order for the points lined up in the direction opposite to the rotation direction of the wafer placing part, for example, V, W, X, Y, Z. |
