发明名称 |
Intercooled electronic device |
摘要 |
An intercooled electronic device, includes a thermally conductive chassis (110), a substrate (120) mounted onto the chassis (110), a housing (104) formed around the chassis (110), and a cooling fan (130) mounted internally within the housing (104). The substrate (120) carries electrical circuitry including at least one heat-generating component (122) which is thermally coupled to the chassis (110). The cooling fan (130) is oriented to direct air across the chassis (110).
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申请公布号 |
US5689403(A) |
申请公布日期 |
1997.11.18 |
申请号 |
US19940363789 |
申请日期 |
1994.12.27 |
申请人 |
MOTOROLA, INC. |
发明人 |
ROBERTSON, JR., WILLIAM H.;REIFF, DAVID E.;CERALDI, RICHARD A.;MUTHUSWAMY, SIVAKUMAR;GYGI, CRAIG K.;GALLOWAY, JESSE E.;GUZIK, ANDRZEJ T.;BRANAN, MACWILLIAM;SUPPELSA ANTHONY J |
分类号 |
H04B1/036;H05K7/20;(IPC1-7):H05H7/20 |
主分类号 |
H04B1/036 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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