APPLICATION OF ADHESIVE TAPE ON DIE PAD OF LEAD FRAME,申请号JP19960101009-传众专利搜索

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发明名称	APPLICATION OF ADHESIVE TAPE ON DIE PAD OF LEAD FRAME
摘要
申请公布号	JPH09289277(A)	申请公布日期	1997.11.04
申请号	JP19960101009	申请日期	1996.04.23
申请人	HITACHI CABLE LTD	发明人	KAWANOBE SUNAO
分类号	H01L23/50;(IPC1-7):H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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