SPUTTERING DEVICE

摘要

A device for metallizing, by sputtering, the surface of a radiation processed radiation sensitive layer on a disc-shaped information carrier, comprising a sputtering vessel (1) to be connected to a vacuum source and provided with a sputtering head (2), said vessel being closable by a cover (4) the inner side of which is designed as a support for the carrier (5) to be sputtered. There is provided at least one sputtering head, the effective diameter of which is smaller than half the inner diameter of the sputtering vessel. Said sputtering head is located spaced from the axis of the sputtering vessel. The cover is designed to rotatingly support the substrate to be sputtered and is adapted to perform two movements relative to the plane of the rim of the vessel, namely a movement perpendicular to said plane between an opened position with the substrate facing to the interior of the vessel and a closed position with the substrate positioned within the vessel, as well as a rotary movement from said opened position about an axis perpendicular to the axis of the sputtering vessel and positioned on the side of the vessel that is turned away from the cover.