Anti-bridging pads for printed circuit boards and interconnecting substrates

摘要

The present invention provides anti-bridging pad(s) for wave soldering of interconnecting substrates. In particular, the present invention provides interconnecting substrates (e.g. printed circuit board) having anti-bridging pad(s) which substantially conform to trailing pad(s), have geometries and/or placements with respect to trailing pad(s) in an array of functional pads which reduce or eliminate solder bridging.