发明名称 Wave soldering process
摘要 A liquid flux using water instead of a volatile organic compound as the liquid carrier is used in a wave soldering process. Undesirable formation of solder balls, solder bridges and solder webbing is prevented by using an air knife to direct a vigorous jet of gas at the dielectric substrate in the preheating section.
申请公布号 US5678752(A) 申请公布日期 1997.10.21
申请号 US19950509925 申请日期 1995.08.01
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 KAMINSKY, MIKE;NOREIKA, RICHARD;OXX, JR., GEORGE D.;POTSKO, DANIEL
分类号 B23K1/20;H05K3/34;(IPC1-7):H05K3/34;B23K3/00 主分类号 B23K1/20
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