A liquid flux using water instead of a volatile organic compound as the liquid carrier is used in a wave soldering process. Undesirable formation of solder balls, solder bridges and solder webbing is prevented by using an air knife to direct a vigorous jet of gas at the dielectric substrate in the preheating section.
申请公布号
US5678752(A)
申请公布日期
1997.10.21
申请号
US19950509925
申请日期
1995.08.01
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
KAMINSKY, MIKE;NOREIKA, RICHARD;OXX, JR., GEORGE D.;POTSKO, DANIEL