| 摘要 |
PROBLEM TO BE SOLVED: To reduce the high-frequency loss by forming a thin-film resistance layer coupling it to a thin-film conductive layer formed by patternizing on the surface of a dielectric substrate having a thin-film conductive layer constituting a grounding surface at the rear. SOLUTION: First of all, a film of a material of a low conductivity is formed on the surface of a dielectric substrate 11 by a method such as evaporation, etc., to make a resistance layer. And an unnecessary resistance layer is removed, and a thin-film resistance layer 12 being at a part to which a resistance R is to be connected is left. After that, a film of a material well-adherable to the dielectric substrate 11 is formed by a method such as evaporation, etc., to make a conductive layer. And this conductive layer is patterned, and constitutes a lower thin-film conductive layer 13. At this time, the lower thin-film conductive layer 13 is cut at a part, and to the cut part the thin-film resistance layer 12 is connected. Furthermore, a film of a material having a conductivity higher than lower thin-film conductive layer 13 is formed by a method such as evaporation, etc., to make a conductive layer. And the end part of the thin-film resistance layer 12 and conductive layers other than the lower thin-film conductive layer 13 are patterned to constitute an upper thin-film conductive layer 14. |
