COMPONENT MOUNTING BOARD, PROCESS FOR PRODUCING THE BOARD, AND PROCESS FOR PRODUCING THE MODULE

摘要

A masking film (3) having desired apertures (2) is applied to a metal wiring board (1). With this construction, a conventional insulation substrate which is to be a thick base and a conventional resist layer can be eliminated. Further, when the terminal parts (T) of the metal wiring board (1) are bent, connection terminals which are substituted for connector terminals for the connection to another board are formed integrally to eliminate the connector terminals. Thus, a low cost component mounting board is provided.