| 摘要 |
PROBLEM TO BE SOLVED: To prevent contact failure by limiting the movement of a connection part of electronic components. SOLUTION: A pair of leads 80, 82 of a light-emitting diode LED are connected by a wire 84, and this connection part is fixed by a fixed portion 86 made of resin. A stopper substrate 10 for limiting the movement of the leads 80, 82 on the connection part is provided. After the leads 80, 82 are bent, he leads are passed through a heating furnace for hardening an adhesive and then immersed with a molten solder. The movement of the connection part in this case is limited by the stopper substrate 10. That is, a residual stress is caused to act by the bending of the leads 80, 82. When the fixed portion 86 made of resin is heated in this state, the leads 80, 82 are moved in the bending direction by the residual stress and therefore the connection of the connection part might be separated. However, since the movement of the connection part is limited by the stopper substrate 10, contact failure of the connection part is prevented and failure in lighting of the light-emitting diode is reduced. |
