| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which can remarkably simplify its manufacturing steps and also to provide a method for fabricating the board. SOLUTION: Conductor circuits 51 and 52 are formed on a plurality of insulating base material layers 22, 21 and 22. Next the above insulating material layers are stacked so that at least one of the conductor circuits is positioned inside the stack, to thereby form multi-layer substrate 2. The multi-layer substrate 2 is formed therein with through holes 110 and 140 passing therethrough. The multi-layer substrate 2 is metal-plated on its entire surface including inner walls of the through holes 110 and 140 to form a metal plated film 10. The insides of the through holes 110 and 140 are filled with filling material 3. Next, the metal plated film in the vicinity of at least one of upper and lower opening ports of the through hole 110 among the through holes 110 and 140 to be formed as a blind via hole 11 is etched to be removed thereby form a base material exposure area 7 which is not coated with the metal plated film and to form an insulating recess 6 between the base material exposure area 7 and filling material 3. |
