| 发明名称 |
Method for enhancing the solderability of a surface |
| 摘要 |
A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed. |
| 申请公布号 |
EP0797380(A1) |
申请公布日期 |
1997.09.24 |
| 申请号 |
EP19970301116 |
申请日期 |
1997.02.20 |
| 申请人 |
MACDERMID INCORPORATED |
发明人 |
FERRIER, DONALD;YAKOBSON, ERIC |
| 分类号 |
B23K1/20;B23K35/00;C22C5/06;C23C18/42;C23C18/44;H05K3/24;H05K3/34 |
主分类号 |
B23K1/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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