发明名称 |
Apparatus and method for polishing workpiece |
摘要 |
A workpiece such as a semiconductor wafer is polished to a flat mirror finish. The workpiece is held by a top ring, and a lower surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, an upper surface of the semiconductor wafer is prevented from being etched by supplying a neutralizer between the upper surface of the semiconductor wafer and the holding surface of the top ring. |
申请公布号 |
US5670011(A) |
申请公布日期 |
1997.09.23 |
申请号 |
US19960643099 |
申请日期 |
1996.05.02 |
申请人 |
EBARA CORPORATION |
发明人 |
TOGAWA, TETSUJI;KIMURA, NORIO |
分类号 |
B24B37/00;B24B37/04;B24B37/30;B24B57/02;(IPC1-7):B24B7/22 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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