| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the contact of a metal piece for constituting a pad electrode with a semiconductor element by constituting the electrode by a square pattern having one side along a scribing direction and a plurality of patterns extended substantially perpendicular to the scribing direction from the square pattern. SOLUTION: A monitoring element 2 for inspecting the characteristics of a semiconductor element 4 formed on a semiconductor substrate is formed in a scribing region 3, and a pad electrode 1 is led from the element 2. The electrode 1 is formed of a patterned metal thin film, and has a square pattern 11 having a long side in the scribing direction and a plurality of bar-like patterns 12 extended perpendicularly to the long side of the pattern 11. In the case of cutting the region 3 by a dicing saw, the pattern 11 for forming the pad 2 is finely cut along the scribing line, the metal thin film for constituting the electrode 1 all becomes short metal thin pieces, and is not brought into contact with the semiconductor element.</p> |
