发明名称 |
SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME |
摘要 |
A semiconductor device in which a semiconductor chip (1) and a circuit board (5) are electrically connected to each other by plastically deforming projected electrodes (4) formed on the chip (1) so that the distances between the end faces of the electrodes (4) and the surfaces of electrode terminals (7) on the circuit board (5) side are uniform. There is also disclosed a process for producing such a semiconductor device, in which the electrical connection between the chip (1) and circuit board (5) is ensured even when the heights of the electrode terminals (7) formed on the circuit board (5) to which the chip (1) is to be connected vary, by pressing the chip (1) from the back after the element is placed in a prescribed position on the circuit board (5) so as to plastically deform the electrodes (4) and make the heights of the electrodes (4) appropriate.
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申请公布号 |
WO9733313(A1) |
申请公布日期 |
1997.09.12 |
申请号 |
WO1997JP00672 |
申请日期 |
1997.03.05 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;SHIRAISHI, TSUKASA;BESSHO, YOSHIHIRO |
发明人 |
SHIRAISHI, TSUKASA;BESSHO, YOSHIHIRO |
分类号 |
H01L21/56;H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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