| 摘要 |
A bump electrode for connecting a semiconductor device with an external lead is disclosed. The bump electrode is designed to eliminate mechanical stress caused by molten metal flowing onto the semiconductor chip during manufacture. The bump electrode metal is formed over an upper and lower foundation film. The lower foundation film extends out laterally beyond the upper foundation film and the bump electrode metal. The lower foundation film does not get wet with the flowing molten metal, and, therefore, prevents the molten metal from flowing onto the chip. |
