发明名称 PLASTIC HOUSING DESIGNED TO ACCOMMODATE ELECTRONIC AND/OR MICROMECHANICAL COMPONENTS AND INTO WHICH CONDUCTOR TRACKS PASS
摘要 The invention concerns a thermoplastic housing designed to hold electronic and/or micromechanical components and into which metal conductor tracks pass, the conductor tracks being injection moulded in one of the housing walls. The thermoplastic has a flexural strength of at least 200 MPa.
申请公布号 EP0793859(A1) 申请公布日期 1997.09.10
申请号 EP19950941003 申请日期 1995.11.23
申请人 DODUCO GMBH + CO DR. EUGEN DUERRWAECHTER I.K. 发明人 KASPAR, FRANZ;KUEHNLE, ANDREAS
分类号 B29C45/14;H01B3/30;H01L23/498;H01R13/405;H05K5/02;(IPC1-7):H01L23/498;G01P1/00 主分类号 B29C45/14
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