发明名称 |
PLASTIC HOUSING DESIGNED TO ACCOMMODATE ELECTRONIC AND/OR MICROMECHANICAL COMPONENTS AND INTO WHICH CONDUCTOR TRACKS PASS |
摘要 |
The invention concerns a thermoplastic housing designed to hold electronic and/or micromechanical components and into which metal conductor tracks pass, the conductor tracks being injection moulded in one of the housing walls. The thermoplastic has a flexural strength of at least 200 MPa. |
申请公布号 |
EP0793859(A1) |
申请公布日期 |
1997.09.10 |
申请号 |
EP19950941003 |
申请日期 |
1995.11.23 |
申请人 |
DODUCO GMBH + CO DR. EUGEN DUERRWAECHTER I.K. |
发明人 |
KASPAR, FRANZ;KUEHNLE, ANDREAS |
分类号 |
B29C45/14;H01B3/30;H01L23/498;H01R13/405;H05K5/02;(IPC1-7):H01L23/498;G01P1/00 |
主分类号 |
B29C45/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|