MULTI-CHIP MODULE MANUFACTURING METHOD AND MULTI-CHIP MODULE

摘要

PROBLEM TO BE SOLVED: To provide a multi-chip module whose cost is reduced by enhancing the general purpose availability. SOLUTION: Interconnection board elements 4 having interconnection patterns and integrated circuit chips 3 are disposed on a support 2, the elements 4 are interconnected to form an expected interconnection pattern on the whole, or interconnection pattern elements are formed on the interconnection board 4, the interconnection pattern elements selected among them are electrically interconnected to form an expected interconnection pattern and the boards 4 are electrically connected to the chips 3.