PATAANKEISEIHOHO

摘要

PURPOSE: To improve the adhesion property to a hydrophobic substrate by adding a component having hydrophilicity to a resin. CONSTITUTION: A resist thin film is formed on the semiconductor substrate 1 by using a pattern forming material 2 and spin coating the substrate with this material and is then soft-baked by a hot plate 3 to remove solvent in the thin film by evaporation and a pattern forming material thin film of thickness of 1.0μm is obtd. (a). Next, the thin film is exposed to a KrF excimer laser 4 via a mask 5 to photodecompose an acid generating agent 2 (b). Tertial butoxy groups are then brought into alkali soluble reaction by baking (PEB) (c). The exposed parts 2b of the pattern forming material 2 are dissolved away by development with an alkaline developer to obtain positive type patterns 2a, 2c (d). The fine patterns 2c of <=1.0μm and more particularly <=0.5μm are formed on the substrate 1 without being peeled from the substrate.