发明名称 Si containing high molecular compound and photosensitive resin composition
摘要 An Si containing high molecular compound is acquired by crosslinking acid obtained by polysilsesquioxane having a vinyl group in a side chain and alkoxysilane. This Si containing high molecular compound is expressed by a general formula given below <CHEM> where R<1> represents a C2-C8 divalent saturated hydrocarbon group, R<2> represents a C1-C8 hydrocarbon group, R<3> represents a C1-C8 hydrocarbon group, Z represents a hydrocarbon atom or trimethylsilyl group, a is 1 to 3, b is 0 to 2 with a sum of a and b being 3, and n is a positive integer selected from 10 to 500. A photosensitive resin composition is obtained by combining the Si containing high molecular compound with a photoacid generator.
申请公布号 EP0745633(A3) 申请公布日期 1997.08.20
申请号 EP19960108666 申请日期 1996.05.30
申请人 NEC CORPORATION 发明人 IWASA, SHIGEYUKI
分类号 G03F7/004;C08G77/18;C08G77/50;C08L83/02;C08L83/04;C09D183/00;C09D183/04;C09D183/14;G03F7/075;H01L21/027 主分类号 G03F7/004
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