The present invention provides a copper-clad laminate characterized in that an electrolytic copper foil (1) on the glossy surface side (1a) of which a copper electrodeposit (2) is formed, is bonded at its glossy surface side (1a) to one side or each of both sides of a substrate (3), which has a fine-pitch wiring (circuit) pattern and exhibits a high etching factor. The present invention further provides a copper-clad laminate which can be suitably employed in the production of such a printed wiring board. <IMAGE>
