Method of producing a post molded cavity package with internal dam bar for integrated circuit

摘要

A method of producing a cavity package (31) around an assembled semiconductor device (24) is disclosed. The method includes providing a chip attach pad (25) having a plurality of chip attach pad straps (33), each strap extending outwardly from the outer edge of the chip attach pad and spaced about the edge of the bar pad; mounting integrated circuits (24) having bond pads on the chip attach pad; molding a package material (31) onto a central portion of lead fingers (28) and the chip attach pad straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring (31) at both the exterior and interior thereof and to secure the chip pad straps (33) therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior the ring; and enclosing both ends of the ring to provide a cavity (34) in the ring to suspend a chip attach pad with the integrated circuit thereon within the cavity with the chip pad straps. Heat sinks can also be used to promote high levels of thermal dissipation.