发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT |
摘要 |
<p>Manufacture is made of a semiconductor integrated circuit wherein the sheet resistivity of the polycrystalline silicon is low and the reproducibility of this sheet resistivity is very high. A manufacturing method for manufacturing the semiconductor integrated circuit is comprised of a step of forming a silicon nitride film on a metal wiring by the use of a plasma CVD method and a step of, after having had the silicon nitride film, performing heat treatment with respect to the resulting structure at a temperature of from 400 DEG C to 480 DEG C. <IMAGE></p> |
申请公布号 |
EP0786811(A1) |
申请公布日期 |
1997.07.30 |
申请号 |
EP19960926616 |
申请日期 |
1996.08.09 |
申请人 |
SEIKO INSTRUMENTS R&D CENTER INC. |
发明人 |
AKAMINE, TADAO;HARADA, HIROFUMI;SATO, KEIJI;INOUE, MASAHIRO;YAMANAKA, JUNKO;SAITO, YUTAKA |
分类号 |
H01L27/04;H01L21/318;H01L21/324;H01L21/768;H01L21/822;(IPC1-7):H01L27/04 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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