发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 <p>Manufacture is made of a semiconductor integrated circuit wherein the sheet resistivity of the polycrystalline silicon is low and the reproducibility of this sheet resistivity is very high. A manufacturing method for manufacturing the semiconductor integrated circuit is comprised of a step of forming a silicon nitride film on a metal wiring by the use of a plasma CVD method and a step of, after having had the silicon nitride film, performing heat treatment with respect to the resulting structure at a temperature of from 400 DEG C to 480 DEG C. &lt;IMAGE&gt;</p>
申请公布号 EP0786811(A1) 申请公布日期 1997.07.30
申请号 EP19960926616 申请日期 1996.08.09
申请人 SEIKO INSTRUMENTS R&D CENTER INC. 发明人 AKAMINE, TADAO;HARADA, HIROFUMI;SATO, KEIJI;INOUE, MASAHIRO;YAMANAKA, JUNKO;SAITO, YUTAKA
分类号 H01L27/04;H01L21/318;H01L21/324;H01L21/768;H01L21/822;(IPC1-7):H01L27/04 主分类号 H01L27/04
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