| 摘要 |
<p>PURPOSE:To enable the high density mounting with simple substrate constitution by making a substrate for mounting electronic parts a structure wherein both surfaces of a multi-layer lead frame are sandwiched by a plurality of base members, and electrically connecting leads and connection parts of the electronic parts by using through holes and the like. CONSTITUTION:A substrate 100 for mounting electronic parts has a structure wherein both surfaces of a multi-layer lead frame 20 are sandwiched by a plurality of base members 10. Leads 21 of the frame 20 are connected with an outer frame 23 via connection parts, and the inside of the frame 20 is provided with an internal connection part 22. On both surfaces of the connection part 22 of the frame 20, the base members 10 composed of material such as resin and ceramics are arranged in a unified body. On the base member 10, a conductor circuit 11 for an electronic parts 30 is formed, and the circuit 11 or connection parts 31 of the parts 30 are electrically connected with the leads 21 by through holes 12 or bonding wires 32.</p> |
