| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a flip-chip mounted semiconductor by improving the method of inspecting a semiconductor chip. SOLUTION: Through holes are formed on a thermosetting resin sheet 6 on a wiring pattern 7 to connect between a semiconductor chip 1 formed with bump electrodes 3 and the thermosetting resin sheet 6 formed with the wiring pattern 7 that is the same in the pattern of circuit wiring. Through the through holes, the bump electrodes 3 and the wiring pattern 7 are connected, using the wiring pattern 7 as the electrodes for inspection, the semiconductor chip 1 is inspected and the connecting electrodes 15 of a circuit wiring board 14 and the bump electrodes 3 are connected electrically and mechanically. |
