HEAT-TREATING DEVICE FOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To appropriately prevent the sideslip of a substrate when the lower surface of the substrate approaches a hot plate in the case where a heat-treating device for substrate carries in the substrate. SOLUTION: A heat-treating device for substrate is provided with a heating means or cooling means, a hot plate 15 which heats or cools a substrate while the plate 15 supports the substrate put on the plate 15, substrate supporting pins 8 which supports the substrate placed on the pins 8, and an air cylinder 10 which elevates/lowers the hot plate 15 and pins 8 relatively to each other. In this heat-treating device, a groove 20 which leads the air between the lower surface of the substrate and the hot plate 15 to the outside of the plate 5 when the cylinder 10 moves the plate 15 and pins 8 relatively to each other and the lower surface of the substrate approaches the plate 15 is formed on the upper surface of the plate 15.