发明名称 CMP CONDITIONER
摘要 PROBLEM TO BE SOLVED: To provide a sharp conditioner that does not give too much load on a workpiece. SOLUTION: A hollow area 21 provided with no abrasive grain is provided at a center of a surface of a grinding wheel base body 19. An abrasive grain layer area is provided in the outside of the hollow area 21. A first abrasive grain layer area 23 in the abrasive grain layer area is provided with plural lines of small abrasive grain layer portions 25 wherein plural diamond super- abrasive grains are adhered on a protuberance portion by an alloy plating phase at intervals. A second abrasive grain layer area 24 in the outside of the first abrasive grains layer portion 23 is structured by a ring-shaped circumferential abrasive grain layer portion 26 wherein super-abrasive grains are adhered on a ring-shaped circumferential protuberance portion by the alloy plating phase. In a surface of the grinding wheel base body 19, at least a surface of the hollow area 21 is covered by a synthetic resin layer R having water repellency.
申请公布号 JP2002346927(A) 申请公布日期 2002.12.04
申请号 JP20010266347 申请日期 2001.09.03
申请人 MITSUBISHI MATERIALS CORP 发明人 YAMASHITA TETSUJI;SHITAMAE NAOKI;HATA HANAKO
分类号 B24B53/12;B24D7/06 主分类号 B24B53/12
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