| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce deformation of a bonding wire, generation of voids, and the bending of a lead frame at the time of resin molding. SOLUTION: This device is tape dam system and constituted of a lead frame 1 which is used for mounting and resin-molding a semiconductor chip and resin for sealing the semiconductor chip. A non-conductive tape 3 of narrow width as a non-conductive member is adhered to a clamping part 13 at the time of resin molding on the lead frame 1, and the tape 3 has the function of a dam bar. The shape of a gate part 7a of the lead frame 1 and the shape of a gate part 7b of the tape 3 are made identical, by cutting the tape 3 formed on a gate part 7 into which the resin is injected, and balance of the injected resin is maintained.</p> |
