| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC chip which can be tested before bump bonding, without damaging bounding pads by test pins, by providing auxiliary test pads electrically connected to the bonding pads. SOLUTION: An integrated circuit device has an integrated circuit, input/ output contact region, two or more metallized layers M1 and M2 and two or more bonding pads 12 and 14 electrically connected to the contact region. It has two or more test pads 16 which are formed on specified position of the top face of the integrated circuit on the upper layer M1 or M2, electrically connected to one of the pads 12 and 14, and disposed not so as to locate on those circuit elements or metallized interconnection which will be broken when the test pins are contacted with pressure.
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