MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD,申请号JP19950284226-传众专利搜索

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发明名称	MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD
摘要	PROBLEM TO BE SOLVED: To inhibit the generation of voids and scale wrinkles on the surface through satisfactory simultaneous hardening at the time of lamination and hardening of an interlayer insulating bonding agent applied on a copper foil and an undercoat agent applied on an internal layer circuit board. SOLUTION: In this manufacturing method, the internal layer circuit board is provided with a thermosetting type or light/thermosetting undercoat agent 3 and a copper foil 5 having the thermosetting type interlayer insulating bonding layer 4 is laminated on the undercoat layer. In this case, the undercoat agent 3 and interlayer insulating bonding agent are mainly composed of epoxy resin and includes the hardening agent of the same kind.
申请公布号	JPH09130039(A)	申请公布日期	1997.05.16
申请号	JP19950284226	申请日期	1995.10.31
申请人	SUMITOMO BAKELITE CO LTD	发明人	HONJIYOUYA TOMOMI;HOZUMI TAKESHI;KISHI TOYOAKI
分类号	H05K3/46;(IPC1-7):H05K3/46	主分类号	H05K3/46
代理机构		代理人
主权项
地址

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