| 摘要 |
PROBLEM TO BE SOLVED: To require much time by the completion of a coating of a bonding agent to a lead frame as the elevating operation and horizontal moving operation of a nozzle for bonding agent discharge use must be repeated each time materials to be coated are changed. SOLUTION: An insulative bonding agent is intermittingly applied on the surface, which is mounted with a semiconductor element, of a lead frame. A nozzle for discharging the bonding agent is moved over the first lead point part 202a, then, is made to descond and the bonding agent is made to discharge from the nozzle to the point part 202a to perform a coating of the bonding agent and after the coating is completed, the nozzle is moved to the following lead point part 202b without performing an elevating operation and without performing bonding agent discharge and performs bonding agent discharge to a bonding agent coating surface of the point part 202b. This operation is repeatedly executed until a coating to a lead point part 202d is completed and the nozzle is made to ascend at the point of time when the coating to the point part 202d ends. Thereby, the time to take for a coating treatment can be shortened. |
