| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition, having low thermal expansion and low dielectric characteristics and useful as an insulating material for electrical parts by adding a mixture of silicon oxide with aluminum oxide as a filler to an epoxy resin. SOLUTION: This resin composition is obtained by blending (A) an epoxy resin with (B) a mixture of (i) silicone oxide with (ii) aluminum oxide as an inorganic filler. An epoxy resin such as a bisphenol A type, bisphenol F type or a brominated bisphenol A type is cited as the component (A). Both the powdery components (i) and (ii) are preferably of a high purity in the component (B) and those with <=1000ppm, preferably <=500ppm content of alkaline earth metallic oxides, e.g. Na2 O, K2 O or CaO, are used. The particle diameter thereof is preferably 1-120μm. The mixing ratio of the component (ii) is 1-10000 pts.wt., preferably 10-1000 pts.wt. based on 100 pts.wt. component (i).
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