| 摘要 |
PROBLEM TO BE SOLVED: To stabilize the positional accuracy and bonding strength of an adhesive bonding sheet by a method wherein slits are respectively formed nearly the inside of the outer edges respectively in the longitudinal direction and width direction of the adhesive bonding sheet remained uncut along the outer edges in a portion corresponding to the dropped part of an outer covering panel. SOLUTION: This IC card assembling sheet 10 is made of a heat-resistant film 1 and an adhesive bonding sheet 2. Only the adhesive bonding sheet 2 is cut in response to the shape of an outer covering panel 6 having a dropped part and its unnecessary part is removed. Further, in the portion, which corresponds to the dropped part of the outer covering panel, 6, of an assembling sheet, slits 1e and 1f. which are parellel to and long the outer edges nearly the inside of the longitudinal outer edges of the adhesive bonding sheet 2 remained uncut, are cut out. Furthermore, slits 1g and 1h, which are parallel to and along the outer edge nearly the inside of the lateral outer edge of the adhesive bonding sheet 2 remained uncut, are cut out under the condition that some part 1i, 1j and 1k are remained uncut. By the structure as mentioned above, the IC card assembling sheet is hard to be subject to the influence of tensile force and wrinkle-free and uniformly bonded state is obtained between the heat-resistant sheet and the adhesive bonding sheet. |
