LEITERPLATTE MIT ABGESCHIRMTEN BEREICHEN SOWIE HERSTELLUNGSVERFAHREN EINER SOLCHEN LEITERPLATTE

摘要

In a method of manufacturing a circuit board having a lateral conductive pattern and shield regions, a first laminate of a substrate, covered on one side by a copper foil, is contour cut whereafter a second entirely covering copper foil is laminated to the second side of the substrate, and a conductive pattern of signal conductors and ground conductors is etched in the second copper foil. The second substrate is also contour cut and is laminated to a copper foil, whereafter a window is etched in the copper foil, corresponding to a window cut in the substrate. The second laminate thus formed is adjusted in regard of the pattern to the first laminate and is adhesively secured thereto, the side of the second laminate covered by the copper foil turned away from the wide of the first laminate provided with the conductive pattern. A metal layer is thereafter applied to the surface of the first laminate facing away from the side having the conductive pattern and the lateral edges to electrically connect the surface, the ground conductors of the conductive pattern and the foil on the second substrate, whereafter components are mounted in the windows in the second laminate to the conductive pattern.