| 摘要 |
PROBLEM TO BE SOLVED: To produce a multilayered printed wiring board conveniently by a transfer lamination system including no photolithography process wherein a wiring pattern comprises a conductive layer, an underlying insulation layer and a resin layer formed sequentially and the insulation layer is made of an insulating material having a hydrophilic group or reacting on the hydrophilic group. SOLUTION: Each wiring pattern layer 3-5 comprises a conductive layer 3a-5a, an insulation layer 3b-5b and a resin layer 3c-5c formed thereunder. The wiring pattern layer 3 is transferred onto a board 2 and the wiring pattern layers 4, 5 are transferred sequentially onto the underlying wiring pattern layers thus constituting an overlapping print structure. At the intersection of respective wiring pattern layers, insulation between upper and lower wiring pattern layers is ensured by the insulation layer constituting the upper wiring pattern layer. Consequently, a multilayer printed wiring board having a highly precise pattern can be produced by a transfer lamination system including no photolithography process. |
