| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure and method for mounting a semiconductor chip with reliability in operation. SOLUTION: In a semiconductor chip, an encapsulating resin flow blocking pattern 20 for surrounding a resin encapsulation prohibiting area 9 where resin encapsulation is prohibited is formed at a semiconductor chip and a circuit board 3. A solder bump 16 is provided on the encapsulating resin flow blocking pattern 20 to prevent the resin flow into the resin encapsulation prohibiting area 9 even when the semiconductor chip is mounted on the circuit board 3. |
