发明名称 DIFFUSION DEVICE OF HEAT AND METHOD OF DIFFUSION OF HEAT
摘要 <p>PROBLEM TO BE SOLVED: To make it possible to install a power equipment on the surface of a printed circuit board by bringing a metallic tab thermally communicating with an integrated circuit into contact with a compressive pad having electrical insulation and thermal conduction and by extending a plurality of fins from a thermally conductive housing adjacent to the pad. SOLUTION: A power equipment 24 is installed on a first surface 20 of a printed circuit board 18. Metallic tab 42 is connected to a silicon integrated circuit 38 in a state of thermal communicating and is separated from the printed circuit board 18 and extended from a plastic housing 40 in-plane almost parallel to the printed circuit board 18. The metallic tab 42 has an upper surface 44 linking with a compressive pad 46 having electrical insulation and thermal conduction; and when the pad 46 is compressed, it becomes thermally conductive, carries heat from the metallic tab 42 to the inside of a housing 14, and electrically insulates electronic equipment from the housing. Compressive pad 46 is fixed with an adhesive to the bottom surface 48 of the housing 14.</p>
申请公布号 JPH0951187(A) 申请公布日期 1997.02.18
申请号 JP19960194790 申请日期 1996.07.24
申请人 BORG WARNER AUTOMOT INC 发明人 JIEEMUZU DEII UOOREN;KAARU AARU BUOGUTO;CHIYAARUZU DEII KURUUZU
分类号 G06F1/20;H01L23/40;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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