| 摘要 |
PROBLEM TO BE SOLVED: To improve the cooling properties, thermal conductivity, electromagnetic wave shielding properties or electric insulation of a component by providing a low thermal conductive partition structure material for partitioning a box body to inverter and electronic board side space, and a low thermal conductive sealing material for sealing the gap. SOLUTION: A low thermal conductive partition structure material 4 made of low thermal conductive material is so provided between an inverter 2 and an electronic board 3 as to partition a box body 1 to an inverter 2 side space and a board 3 side space. Further, the gap between the body 1 and the material 4 or the gap between wiriness 5 and the material 4 is sealed by a low thermal conductive sealing material 6. With this structure, the heat from the inverter 2 is cut OFF by the material 4 and the material 6, and hence it is not almost transmitted to the board 3. Accordingly, the temperature rise of the board 3 due to the heat from the inverter 2 can be prevented. |
