| 摘要 |
PROBLEM TO BE SOLVED: To reduce the malfunction of a semiconductor package due to generated heat and to improve the heat radiating efficiency from the package by increasing the contact surface of the package with the air by forming numerous bent sections on the external surface of a molding resin. SOLUTION: The metallic mold of a molding resin 3 to encapsulate a semiconductor chip 1 in a molding process is formed so that the external surface of the resin 3, namely, the contact surface of the resin 3 with the air can be formed in a wavy pattern. Since the surface area of a semiconductor package which is exposed to the outside air increases, the heat radiating area of the package through which the heat generated from the package is radiated to the outside air increases. Therefore, the malfunction of the package due to the generated heat can be reduced and the heat radiating efficiency of the package can be improved. |
