| 摘要 |
PROBLEM TO BE SOLVED: To achieve alignment with high accuracy without correcting an alignment mark even if the processed surface of a wafer is rough. SOLUTION: Polarizing plates 7a and 7b which change the plane of polarization of the laser beam illuminating an alignment mark 12 via a projection lens 11 is provided. The plane of polarization is so that the intensity of light reflected from the alignment mark is maximum and alignment is performed by the plane of polarization. |
