| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique, which uses a liquid resin as a sealing agent and can transfer an electronic component sealed with the liquid resin by suction. SOLUTION: In a method of sealing an electronic component, which seals the electronic component with a liquid resin and thereafter, cures the liquid resin, a flat plate 5, which can be mold-released from the resin 4 subsequent to the curing, is placed on the liquid resin, with which the electronic component is sealed, and thereafter, the resin 4 is gelled or is cured. |
