| 摘要 |
<p>PROBLEM TO BE SOLVED: To make it possible to mount a semiconductor element on a board easily, in a short time and with good accuracy by a method wherein the element is placed on a jig for alignment use in such a way that bumps oppose to holes, which correspond to the other surface of the jig, or the bumps are fitted into the holes and a solder on the contact part of the element with the board is melted by heating. SOLUTION: A jig 10 for alignment use, which is formed by boring through holes 10A therein according to the arrangement of bumps 2A on the rear of a semiconductor element 2 which is an object to be mounted, is placed on a board 1 in such a way that the holes 10A oppose to electrodes 1A, which correspond to the holes 10A, on the board 1. The element 2 is placed on the jig 10 in such a way that the bumps 2A are fitted into the holes 10A, which correspond to the other surface of the jig 10. After that, the element 2 is pulled up, the jig 10 is removed from the upper part of the board 1 and after this, the element 2 is made to descend to mount on the board 1 and thereafter, the element 2 is bonded to the board 1 in such a way that a solder on the contact part of the element 2 with the board 1 is molten by heating.</p> |
