发明名称 |
COPPER FOIL FOR THE MANUFACTURE OF PRINTED CIRCUITS AND METHOD OF PRODUCING SAME |
摘要 |
A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compounds of trivalent chromium, which protective layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.
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申请公布号 |
CA2227179(A1) |
申请公布日期 |
1997.02.06 |
申请号 |
CA19952227179 |
申请日期 |
1995.07.20 |
申请人 |
CIRCUIT FOIL S.A. |
发明人 |
STREEL, MICHEL;ACX, KURT;MATHIEU, MICHEL;WOLSKI, ADAM M.;DUFRESNE, PAUL |
分类号 |
H05K3/38;C25D5/34;C25D7/06;H05K;H05K3/46;(IPC1-7):C25D3/56;H05K1/09 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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