| 摘要 |
PROBLEM TO BE SOLVED: To easily form a desired metallic film pattern by forming in order a SnCl2 layer, a Pd layer and an electroless metallic plating layer on a pattern of a titanate-based coupler layer formed on a substrate by a UV rays ozone treatment. SOLUTION: A titanate-based coupler layer 3 is formed on the whole surface of a main surface of a glass substrate 1 on which an ITO layer 2 is formed partially by coating and heat treating. Then, the pattern of the coupler layer 3 in which an exposed part is removed by a UV rays ozone treatment is formed by irradiating the main surface by interposing a chromium mask 4 with the UV rays 5. Then, a sensitizing layer 6 consisting of the SnCl2 is formed on the pattern by treating with a SnCl2 aq. soln.. A Pd-containing activation layer 7 is formed on this SnCl2 layer 3 by treating the substrate 1 with a PdCl2 aq. soln.. After that, a metallic layer 8 having a prescribed pattern is formed by immersing this main surface in an electroless metallizing bath through the titanate based coupler layer 3 independent of a photolithography technology. |
