| 摘要 |
PROBLEM TO BE SOLVED: To prevent a tape for bonding inner leads and a chip together from being stripped off the chip, and prevent degradation in the performance of a package due to the coupling effect between adjacent inner leads. SOLUTION: This lead frame consists of a plurality of inner leads 122 that are positioned on the top of a chip to be mounted, and that are electrically connected with a plurality of bonding pads formed on the top of the chip, respectively; a plurality of outer leads 124 formed integrally with the inner leads 122; tie bars 140 that are placed on both sides of the lead frame 150 in the direction of width opposite to each other with an adhesive tape stuck to the underside of their ends, and that are extended toward the center of the lead frame 150 so that one side of a chip and their edge portions can be bonded together using the tape; and side rails that support the outer leads and the tip bars, and that are placed on both sides of the lead frame in the direction of length opposite to each other. |
