| 摘要 |
PURPOSE: To cope with fine pitch of wirings of a semiconductor element, by constituting an aperture part of a through hole part which reaches from the surface of an insulating substrate to the layer surface of a conducting circuit and a recessed part formed on the layer surface of the conducting circuit which part has an outer diameter which is wholly enlarged by setting the aperture of the lower end of the through hole part as a center. CONSTITUTION: A film carrier is constituted as follows; a conducting circuit 2 is formed inside an insulating substrate 1, an aperture part 3 is formed on a specified position of one side surface of the insulating substrate 1, a conducting circuit is exposed on the bottom of the aperture part 3, and a conducting path 4 is formed by filling the inside of the aperture part 3 with a conducting material. The upper end of the conducting path 4 acts as a contact part 5 for electrical contact with an outer contact object. The aperture part 3 is constituted of a penetrating hole part 3a which reaches from the surface 1a of the insulating substrate 1 to the surface 2a of a layer of the conducting circuit 2, and a recessed part 3b formed on the layer surface of the conducting circuit which part 3b has an outer peripheral shape of an outer diameter which is wholly enlarged by setting the aperture of the lower end of the penetrating hole part 3a as a center.
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