COPPER CLAD RESIN COMPOSITE MATERIAL

摘要

PURPOSE: To obtain a smooth and voidless copper clad resin composite material enhanced in the molding efficiency by guick curing and enhanced in heat resistance and reliability by coating copper foil with a compsn. prepared by adding dicyandiamide and a curing accelerator to a polyfunctional epoxy resin and a brominated poxy resin. CONSTITUTION: A resin compsn. is obtained by adding 1.0-4.0 pts.wt. of dicyandiamide and 10-95mol% with respect to dicyandiamide of a curing accelerator having potentiality at the normal temp. to 100 pts.wt. of an epoxy resin consisting of 3-50 pts.wt. of a polyfunctional epoxy resin, a brominated epoxy resin of which the amt. sets bromine content to 25% by wt. of the total epoxy resin content and a bisphenol A type difunctional epoxy resin. This compsn. is directly applied to copper foil in a thickness of 20-200μm by hot melt coating to obtain a copper clad resin composite material.